- Package / Case :
- Memory Type :
- Access Time :
- Part Status :
- Memory Format :
- Clock Frequency :
- Voltage - Supply :
61 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 0 | |||
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VIEW | Texas Instruments | IC SRAM 16M PARALLEL 76CFP | 76-CQFP | - | Bulk | Volatile | 16Mb (512K x 32) | SRAM | 20ns | Surface Mount | -55°C ~ 125°C (TC) | Obsolete | SRAM | - | 20ns | Parallel | 1.7 V ~ 3.6 V | 76-CFP (45.72x51.31) | 0 | 1 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 120NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 120NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 |
