- Package / Case :
-
- 24-CDIP (0.300", 7.62mm) (2)
- 24-CDIP (0.600", 15.24mm) (2)
- 24-DIP Module (0.600", 15.24mm) (5)
- 28-BCPGA (1)
- 28-CDIP (0.600", 15.24mm) (6)
- 28-CFlatPack (5)
- 28-DIP (0.600", 15.24mm) (2)
- 28-DIP Module (0.600", 15.24mm) (7)
- 28-SOIC (0.295", 7.50mm Width) (8)
- 28-SOIC (0.342", 8.69mm Width) (1)
- 28-TSSOP (0.465", 11.80mm Width) (9)
- 32-CDIP (0.600", 15.24mm) Window (2)
- 32-CFlatpack (1)
- 32-CLCC (7)
- 32-DIP Module (0.600", 15.24mm) (2)
- 32-LCC (J-Lead) (18)
- 32-TFSOP (0.724", 18.40mm Width) (4)
- 34-PowerCap™ Module (5)
- 36-DIP Module (0.600", 15.24mm) (2)
- 44-CLCC (2)
- 44-TSOP (0.400", 10.16mm Width) (1)
- 48-TFSOP (0.488", 12.40mm Width) (4)
- 56-BCPGA (2)
- Packaging :
- Memory Type :
- Mounting Type :
- Memory Format :
- Memory Interface :
- Supplier Device Package :
-
- 24-CDIP (4)
- 24-EDIP (3)
- 24-PCDIP, CAPHAT® (2)
- 28-CDIP (6)
- 28-CPGA (13.97x16.51) (1)
- 28-EDIP (7)
- 28-Flatpack, Ceramic Bottom-Brazed (5)
- 28-PDIP (2)
- 28-SOIC (8)
- 28-SOP (1)
- 28-TSOP (8)
- 28-TSOP I (1)
- 32-CDIP (2)
- 32-EDIP (2)
- 32-Flatpack, Ceramic Bottom-Brazed (1)
- 32-LCC (11.43x13.97) (7)
- 32-PLCC (10)
- 32-PLCC (11.43x13.97) (8)
- 32-TSOP (3)
- 32-TSSOP (1)
- 34-PowerCap Module (5)
- 36-EDIP (2)
- 44-CLCC (16.54x16.54) (2)
- 44-TSOP (1)
- 48-TSOP (4)
- 56-CPGA (2)
- Applied Filters :
98 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC | 0 | 0 | |||
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VIEW | Renesas Electronics America Inc. | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | - | 5ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC (11.43x13.97) | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CPGA | 28-BCPGA | - | Tray | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CPGA (13.97x16.51) | 0 | 0 | |||
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VIEW | Maxim Integrated | IC NVSRAM 16M PARALLEL 36EDIP | 36-DIP Module (0.600", 15.24mm) | - | Tube | Non-Volatile | 16Mb (2M x 8) | NVSRAM (Non-Volatile SRAM) | 150ns | Through Hole | 0°C ~ 70°C (TA) | Active | NVSRAM | - | 150ns | Parallel | 3 V ~ 3.6 V | 36-EDIP | 0 | 0 | |||
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VIEW | Maxim Integrated | IC NVSRAM 4M PARALLEL 34PWRCAP | 34-PowerCap™ Module | - | Tube | Non-Volatile | 4Mb (512K x 8) | NVSRAM (Non-Volatile SRAM) | 150ns | Surface Mount | 0°C ~ 70°C (TA) | Active | NVSRAM | - | 150ns | Parallel | 3 V ~ 3.6 V | 34-PowerCap Module | 0 | 0 | |||
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VIEW | Fujitsu Electronics America, Inc. | IC FRAM 4M PARALLEL 48TSOP | 48-TFSOP (0.488", 12.40mm Width) | - | Tray | Non-Volatile | 4Mb (256K x 16) | FRAM (Ferroelectric RAM) | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | FRAM | - | 150ns | Parallel | 3 V ~ 3.6 V | 48-TSOP | 0 | 500 | |||
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VIEW | Fujitsu Electronics America, Inc. | IC FRAM 4M PARALLEL 48TSOP | 48-TFSOP (0.488", 12.40mm Width) | - | Tray | Non-Volatile | 4Mb (512K x 8) | FRAM (Ferroelectric RAM) | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | FRAM | - | 150ns | Parallel | 3 V ~ 3.6 V | 48-TSOP | 0 | 500 | |||
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VIEW | Fujitsu Electronics America, Inc. | IC FRAM 1M PARALLEL 48TSOP | 48-TFSOP (0.488", 12.40mm Width) | - | Tray | Non-Volatile | 1Mb (64K x 16) | FRAM (Ferroelectric RAM) | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | FRAM | - | 150ns | Parallel | 3 V ~ 3.6 V | 48-TSOP | 0 | 500 | |||
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VIEW | Fujitsu Electronics America, Inc. | IC FRAM 256K PARALLEL 28SOP | 28-SOIC (0.342", 8.69mm Width) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | FRAM (Ferroelectric RAM) | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | FRAM | - | 150ns | Parallel | 2.7 V ~ 3.6 V | 28-SOP | 0 | 1000 | |||
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VIEW | Fujitsu Electronics America, Inc. | IC FRAM 256K PARALLEL 28TSOP I | 28-TSSOP (0.465", 11.80mm Width) | - | Tray | Non-Volatile | 256Kb (32K x 8) | FRAM (Ferroelectric RAM) | 150ns | Surface Mount | -40°C ~ 85°C (TA) | Active | FRAM | - | 150ns | Parallel | 2.7 V ~ 3.6 V | 28-TSOP I | 0 | 500 | |||
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VIEW | Honeywell Aerospace | IC EEPROM 256K PARALLEL 56CPGA | 56-BCPGA | - | Bulk | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 225°C (TA) | Active | EEPROM | 5MHz | 90ms | Parallel, SPI | 4.75 V ~ 5.25 V | 56-CPGA | 0 | 1 | |||
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VIEW | Honeywell Aerospace | IC EEPROM 256K PARALLEL 56CPGA | 56-BCPGA | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 225°C (TA) | Active | EEPROM | 5MHz | 90ms | Parallel, SPI | 4.75 V ~ 5.25 V | 56-CPGA | 0 | 1 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | |||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32CLCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 3ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32CLCC | 32-CLCC | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 |
