- Package / Case :
-
- 8-DIP (0.300", 7.62mm) (9)
- 8-SOIC (0.154", 3.90mm Width) (20)
- 8-SOIC (0.173", 4.40mm Width) (1)
- 8-TSSOP (0.173", 4.40mm Width) (14)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (11)
- 8-UFDFN Exposed Pad (1)
- 8-VFDFN Exposed Pad (3)
- 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) (1)
- 8-WFDFN Exposed Pad (5)
- Die (30)
- Series :
- Packaging :
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80 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 2MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | -40°C ~ 125°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 4.5 V ~ 5.5 V | 8-PDIP | 0 | 420 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 6.0 V | 8-PDIP | 0 | 480 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 6.0 V | 8-PDIP | 0 | 480 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 2MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 2MHz | 10ms | SPI | 4.5 V ~ 5.5 V | 8-SOIC | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 6 V | 8-PDIP | 0 | 480 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 6.0 V | 8-SOIC | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 6.0 V | 8-SOIC | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 6 V | 8-SOIC | 0 | 500 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 1.8 V ~ 6 V | 8-SOIC | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8SOIC | 8-SOIC (0.154", 3.90mm Width) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 6.0 V | 8-SOIC | 0 | 500 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-PDIP | 0 | 840 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8DIP | 8-DIP (0.300", 7.62mm) | - | Tube | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Through Hole | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-PDIP | 0 | 840 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ 8TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tape & Reel (TR) | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 125°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | 8-TSSOP | 0 | 2500 |
