- Package / Case :
-
- 14-LSSOP (0.173", 4.40mm Width) (1)
- 14-SOIC (0.154", 3.90mm Width) (1)
- 28-BCPGA (1)
- 28-CDIP (0.600", 15.24mm) (16)
- 28-CFlatPack (16)
- 28-DIP (0.600", 15.24mm) (2)
- 28-SOIC (0.295", 7.50mm Width) (29)
- 28-TSSOP (0.465", 11.80mm Width) (25)
- 30-BCPGA (1)
- 32-CDIP (0.600", 15.24mm) Window (6)
- 32-CFlatpack (6)
- 32-CLCC (22)
- 32-LCC (J-Lead) (56)
- 32-TFSOP (0.465", 11.80mm Width) (1)
- 32-TFSOP (0.724", 18.40mm Width) (12)
- 4-XFBGA, WLBGA (1)
- 44-CLCC (4)
- 8-DIP (0.300", 7.62mm) (25)
- 8-LSSOP (0.173", 4.40mm Width) (2)
- 8-SOIC (0.154", 3.90mm Width) (73)
- 8-SOIC (0.173", 4.40mm Width) (4)
- 8-TSSOP (0.173", 4.40mm Width) (9)
- 8-UBGA, WLCSP (2)
- 8-UFDFN Exposed Pad (1)
- 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) (2)
- 8-XFBGA, WLCSP (5)
- Packaging :
- Memory Size :
-
- 16Kb (1K x 16) (1)
- 16Kb (2K x 8, 1K x 16) (7)
- 1Kb (128 x 8 , 64 x 16) (11)
- 1Kb (128 x 8 or 64 x 16) (5)
- 1Kb (128 x 8) (21)
- 1Kb (128 x 8, 64 x 16) (4)
- 1Mb (128K x 8) (55)
- 256Kb (32K x 8) (110)
- 2Kb (128 x 16) (1)
- 2Kb (128 x 8 x 2) (2)
- 2Kb (256 x 8) (6)
- 2Kb (256 x 8, 128 x 16) (18)
- 2Mb (256K x 8) (17)
- 4Kb (256 x 16) (1)
- 4Kb (512 x 8) (1)
- 4Kb (512 x 8, 256 x 16) (22)
- 64Kb (8K x 8) (33)
- 8Kb (1K x 8, 512 x 16) (3)
- 8Kb (512 x 16) (5)
- Access Time :
- Mounting Type :
- Clock Frequency :
- Memory Interface :
- Supplier Device Package :
-
- 14-SOP (1)
- 14-SSOP (1)
- 28-CDIP (16)
- 28-CPGA (13.97x16.51) (1)
- 28-Flatpack, Ceramic Bottom-Brazed (16)
- 28-PDIP (2)
- 28-SOIC (29)
- 28-TSOP (24)
- 28-TSSOP (1)
- 30-CPGA (16.51x13.97) (1)
- 32-CDIP (6)
- 32-Flatpack, Ceramic Bottom-Brazed (6)
- 32-LCC (11.43x13.97) (22)
- 32-PLCC (32)
- 32-PLCC (11.43x13.97) (24)
- 32-TSOP (12)
- 32-TSSOP (1)
- 4-WLP (0.79x1.06) (1)
- 44-CLCC (16.54x16.54) (4)
- 8-DIP (3)
- 8-MFP (1)
- 8-Mini Map (2x3) (1)
- 8-PDIP (22)
- 8-SO (2)
- 8-SOIC (62)
- 8-SOP (11)
- 8-SOP-J (1)
- 8-SSOPB (2)
- 8-TMSOP (2)
- 8-TSSOP (9)
- 8-WLCSP (2)
- 8-WLCSP (3.12x2.04) (2)
- 8-WLCSP (3.56x2.01) (2)
- 8-WLCSP (5x3) (1)
- Factory Stock :
- Applied Filters :
323 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | 120ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC | 0 | 0 | ||||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tape & Reel (TR) | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 2M SPI 5MHZ 8WLCSP | 8-XFBGA, WLCSP | - | Tape & Reel (TR) | Non-Volatile | 2Mb (256K x 8) | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 5MHz | 10ms | SPI | 1.7 V ~ 5.5 V | 8-WLCSP | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CPGA | 28-BCPGA | - | Tray | Non-Volatile | 256Kb (32K x 8) | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CPGA (13.97x16.51) | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 2M SPI 5MHZ 12WLCSP | 8-XFBGA, WLCSP | - | Tape & Reel (TR) | Non-Volatile | 2Mb (256K x 8) | - | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | 5MHz | 10ms | SPI | 1.7 V ~ 5.5 V | 8-WLCSP (5x3) | 0 | 0 | ||||
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VIEW | Microchip Technology | IC EEPROM 2M I2C 1MHZ 8WLCSP | 8-XFBGA, WLCSP | - | Tape & Reel (TR) | Non-Volatile | 2Mb (256K x 8) | 450ns | Surface Mount | -40°C ~ 85°C (TC) | Active | EEPROM | 1MHz | 10ms | I²C | 1.7 V ~ 5.5 V | 8-WLCSP | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 30CPGA | 30-BCPGA | - | Tray | Non-Volatile | 1Mb (128K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 30-CPGA (16.51x13.97) | 0 | 0 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 0 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | ||||
|
VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | ||||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | ||||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 120NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 200ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | ||||
|
VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32CDIP | 32-CDIP (0.600", 15.24mm) Window | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-CDIP | 0 | 12 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | ||||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 150NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | ||||
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VIEW | Microchip Technology | IC EEPROM 1MBIT 120NS 44CLCC | 44-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 44-CLCC (16.54x16.54) | 0 | 29 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | ||||
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VIEW | Microchip Technology | IC EEPROM 1M PARALLEL 32LCC | 32-CLCC | - | Tube | Non-Volatile | 1Mb (128K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-LCC (11.43x13.97) | 0 | 34 | ||||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | ||||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 120ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 | ||||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28CDIP | 28-CDIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Through Hole | -55°C ~ 125°C (TC) | Active | EEPROM | - | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-CDIP | 0 | 14 |