- Package / Case :
-
- 14-TSSOP (0.173", 4.40mm Width) (13)
- 16-SOIC (0.154", 3.90mm Width) (4)
- 20-TSSOP (0.173", 4.40mm Width) (18)
- 8-DIP (0.300", 7.62mm) (113)
- 8-SOIC (0.154", 3.90mm Width) (216)
- 8-SOIC (0.173", 4.40mm Width) (18)
- 8-SOIC (0.209", 5.30mm Width) (4)
- 8-TDFN (1)
- 8-TSSOP (0.173", 4.40mm Width) (120)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (105)
- 8-UFDFN Exposed Pad (11)
- 8-VFBGA (2)
- 8-VFDFN Exposed Pad (15)
- 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) (13)
- 8-WDFN Exposed Pad (2)
- 8-WFDFN Exposed Pad (25)
- Die (150)
- SOT-23-6 (40)
- Packaging :
- Memory Size :
-
- 128Kb (16K x 8) (21)
- 16Kb (1K x 16) (53)
- 16Kb (2K x 8) (65)
- 16Kb (2K x 8, 1K x 16) (82)
- 1Kb (128 x 8 , 64 x 16) (41)
- 1Kb (128 x 8) (12)
- 1Kb (128 x 8, 64 x 16) (23)
- 1Kb (64 x 16) (12)
- 256Kb (32K x 8) (14)
- 2Kb (128 x 16) (12)
- 2Kb (256 x 8) (12)
- 2Kb (256 x 8, 128 x 16) (70)
- 32Kb (4K x 8) (31)
- 4Kb (256 x 16) (15)
- 4Kb (512 x 8) (25)
- 4Kb (512 x 8, 256 x 16) (65)
- 64Kb (8K x 8) (29)
- 8Kb (1K x 8) (65)
- 8Kb (1K x 8, 512 x 16) (76)
- 8Kb (512 x 16) (52)
- Mounting Type :
- Operating Temperature :
- Part Status :
- Supplier Device Package :
-
- 14-TSSOP (13)
- 16-SOIC (4)
- 20-TSSOP (18)
- 8-dBGA (3.73x2.21) (1)
- 8-dBGA (4.07x2.47) (1)
- 8-DFN (2x3) (15)
- 8-DIP (4)
- 8-DIP-T (2)
- 8-LAP (5x6) (1)
- 8-MSOP (103)
- 8-PDIP (107)
- 8-SOIC (212)
- 8-SOP (17)
- 8-SOP-J (9)
- 8-SSOPB (5)
- 8-TDFN (2x3) (25)
- 8-TDFN (3x3) (2)
- 8-TSSOP (106)
- 8-TSSOP-B (13)
- 8-TSSOP-BJ (11)
- VSON008X2030 (11)
- Minimum Quantity :
-
- 1 (69)
- 100 (2)
- 1000 (11)
- 1080 (2)
- 1100 (10)
- 1140 (4)
- 1150 (1)
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- 960 (1)
- Applied Filters :
775 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 5ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 1K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 6ms | SPI | 2.5 V ~ 5.5 V | Die | 0 | 0 |
