- Manufacture :
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- Maxim Integrated (61)
- Microchip Technology (751)
- ROHM Semiconductor (2)
- STMicroelectronics (7)
- Renesas Electronics America (11)
- Cypress Semiconductor Corp (207)
- Honeywell Aerospace (1)
- Renesas Electronics America Inc. (4)
- IDT, Integrated Device Technology Inc (673)
- ISSI, Integrated Silicon Solution Inc (90)
- Macronix (32)
- Alliance Memory, Inc. (169)
- Package / Case :
-
- 100-LQFP (46)
- 108-BPGA (16)
- 120-LQFP (4)
- 24-CDIP (0.300", 7.62mm) (17)
- 24-CDIP (0.600", 15.24mm) (16)
- 24-DIP (0.300", 7.62mm) (8)
- 24-DIP Module (0.600", 15.24mm) (8)
- 24-SOIC (0.295", 7.50mm Width) (16)
- 28-BCPGA (1)
- 28-BSOJ (0.300", 7.62mm Width) (68)
- 28-CDIP (0.300", 7.62mm) (27)
- 28-CDIP (0.600", 15.24mm) (54)
- 28-CFlatPack (19)
- 28-DIP (0.300", 7.62mm) (15)
- 28-DIP (0.600", 15.24mm) (10)
- 28-DIP Module (0.600", 15.24mm) (20)
- 28-SOIC (0.295", 7.50mm Width) (33)
- 28-SOIC (0.330", 8.38mm Width) (14)
- 28-SOP (0.350", 8.89mm Width) with SNAPHAT Sockets (2)
- 28-TSSOP (0.465", 11.80mm Width) (66)
- 30-BCPGA (1)
- 32-BSOJ (0.300", 7.62mm Width) (26)
- 32-BSOJ (0.400", 10.16mm Width) (46)
- 32-CDIP (0.600", 15.24mm) Window (6)
- 32-CFlatpack (6)
- 32-CLCC (26)
- 32-DIP (0.600", 15.24mm) (9)
- 32-DIP Module (0.600", 15.24mm) (15)
- 32-LCC (J-Lead) (102)
- 32-LFSOP (0.465", 11.80mm Width) (4)
- 32-SOIC (0.295", 7.50mm Width) (6)
- 32-SOIC (0.400", 10.16mm Width) (14)
- 32-SOIC (0.445", 11.30mm Width) (22)
- 32-SOIC (0.450", 11.40mm Width) (2)
- 32-TFSOP (0.465", 11.80mm Width) (7)
- 32-TFSOP (0.488", 12.40mm Width) (23)
- 32-TFSOP (0.724", 18.40mm Width) (42)
- 34-PowerCap™ Module (18)
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- 48-LCC (33)
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- 8-TSSOP (0.173", 4.40mm Width) (81)
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- 8-WFDFN Exposed Pad (28)
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- 84-LCC (J-Lead) (11)
- Die (90)
- SC-74A, SOT-753 (3)
- SOT-23-6 (44)
- Packaging :
- Memory Type :
- Memory Size :
-
- 1.125Mb (64K x 18) (4)
- 128b (16 x 8) (19)
- 128Kb (16K x 8) (30)
- 128Kb (8K x 16) (33)
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- 16Kb (1K x 16) (16)
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- 256Kb (32K x 8) (320)
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- 2Mb (128K x 16) (4)
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- 32Kb (2K x 16) (56)
- 32Kb (4K x 8) (40)
- 36Kb (4K x 9) (5)
- 4Kb (256 x 16) (19)
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- 8Kb (1K x 8) (81)
- 8Kb (1K x 8, 512 x 16) (26)
- 8Kb (512 x 16) (16)
- 8Mb (1M x 8) (15)
- 8Mb (512K x 16) (8)
- Technology :
- Mounting Type :
- Memory Format :
- Clock Frequency :
- Memory Interface :
- Supplier Device Package :
-
- 100-TQFP (4)
- 100-TQFP (14x14) (39)
- 100-TQFP (14x20) (3)
- 108-PGA (30.48x30.48) (16)
- 120-TQFP (14x14) (4)
- 24-CDIP (33)
- 24-EDIP (6)
- 24-PCDIP, CAPHAT® (2)
- 24-PDIP (8)
- 24-SOIC (16)
- 28-CDIP (48)
- 28-CerDip (32)
- 28-CPGA (13.97x16.51) (1)
- 28-DIP (1)
- 28-EDIP (17)
- 28-Flatpack, Ceramic Bottom-Brazed (19)
- 28-PCDIP, CAPHAT® (3)
- 28-PDIP (25)
- 28-SOH (2)
- 28-SOIC (33)
- 28-SOJ (68)
- 28-SOP (14)
- 28-TSOP (37)
- 28-TSOP I (28)
- 28-TSSOP (1)
- 30-CPGA (16.51x13.97) (1)
- 32-CDIP (6)
- 32-DIP (6)
- 32-EDIP (15)
- 32-Flatpack, Ceramic Bottom-Brazed (6)
- 32-LCC (11.43x13.97) (26)
- 32-PDIP (3)
- 32-PLCC (61)
- 32-PLCC (11.43x13.97) (39)
- 32-PLCC (11.43x14.05) (2)
- 32-SOIC (22)
- 32-SOJ (72)
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- 32-TSOP II (14)
- 32-TSSOP (1)
- 34-PowerCap Module (18)
- 36-EDIP (5)
- 36-SOJ (18)
- 40-PDIP (3)
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- 42-SOJ (4)
- 44-CLCC (16.54x16.54) (4)
- 44-PLCC (16.59x16.59) (12)
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- 44-SOP (11)
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- 48-LCC (14.22x14.22) (33)
- 48-PDIP (12)
- 48-SIDE BRAZED (50)
- 48-TSOP (16)
- 48-TSOP I (14)
- 48-VFBGA (6x8) (18)
- 50-TSOP II (1)
- 50/44-TSOP II (4)
- 52-PLCC (19.13x19.13) (37)
- 54-TSOP II (12)
- 64-TQFP (8)
- 64-TQFP (10x10) (8)
- 64-TQFP (14x14) (28)
- 68-FPACK (14)
- 68-PGA (29.46x29.46) (80)
- 68-PLCC (24.21x24.21) (20)
- 8-DFN (2x3) (17)
- 8-DIP (3)
- 8-MSOP (68)
- 8-PDIP (57)
- 8-SOIC (178)
- 8-TDFN (2x3) (28)
- 8-TSSOP (85)
- 80-TQFP (14x14) (3)
- 84-FLATPAK (12)
- 84-PGA (27.94x27.94) (51)
- 84-PLCC (29.31x29.31) (11)
- SOT-23-5 (3)
- Factory Stock :
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- Applied Filters :
2008 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
VIEW | Renesas Electronics America | IC SRAM IBIS ASYNC | 44-TSOP (0.400", 10.16mm Width) | - | Tube | Volatile | 4Mb (256K x 16) | SRAM | 12ns | Surface Mount | 0°C ~ 70°C (TA) | Active | SRAM | - | 12ns | Parallel | 4.5 V ~ 5.5 V | 44-TSOP II | 0 | 0 | |||
|
|
|
VIEW | Renesas Electronics America | IC SRAM IBIS ASYNC | 44-TSOP (0.400", 10.16mm Width) | - | Tube | Volatile | 4Mb (256K x 16) | SRAM | 12ns | Surface Mount | 0°C ~ 70°C (TA) | Active | SRAM | - | 12ns | Parallel | 4.5 V ~ 5.5 V | 44-TSOP II | 0 | 0 | |||
|
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VIEW | Renesas Electronics America | IC SRAM IBIS ASYNC | 44-TSOP (0.400", 10.16mm Width) | - | Tube | Volatile | 4Mb (256K x 16) | SRAM | 12ns | Surface Mount | 0°C ~ 70°C (TA) | Active | SRAM | - | 12ns | Parallel | 4.5 V ~ 5.5 V | 44-TSOP II | 0 | 0 | |||
|
|
|
VIEW | ISSI, Integrated Silicon Solution Inc | IC DRAM 16M PARALLEL 50TSOP II | 50-TSOP (0.400", 10.16mm Width), 44 Leads | - | Tray | Volatile | 16Mb (1M x 16) | DRAM - FP | 25ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | - | 84ns | Parallel | 4.5 V ~ 5.5 V | 50/44-TSOP II | 0 | 0 | |||
|
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|
VIEW | ISSI, Integrated Silicon Solution Inc | IC DRAM 16M PARALLEL 50TSOP II | 50-TSOP (0.400", 10.16mm Width), 44 Leads | - | Tray | Volatile | 16Mb (1M x 16) | DRAM - EDO | 25ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | - | 85ns | Parallel | 4.5 V ~ 5.5 V | 50/44-TSOP II | 0 | 0 | |||
|
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|
VIEW | ISSI, Integrated Silicon Solution Inc | IC DRAM 16M PARALLEL 50TSOP II | 50-TSOP (0.400", 10.16mm Width), 44 Leads | - | Tape & Reel (TR) | Volatile | 16Mb (1M x 16) | DRAM - FP | 25ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | - | 84ns | Parallel | 4.5 V ~ 5.5 V | 50/44-TSOP II | 0 | 0 | |||
|
|
|
VIEW | ISSI, Integrated Silicon Solution Inc | IC DRAM 16M PARALLEL 50TSOP II | 50-TSOP (0.400", 10.16mm Width), 44 Leads | - | Tape & Reel (TR) | Volatile | 16Mb (1M x 16) | DRAM - EDO | 25ns | Surface Mount | -40°C ~ 85°C (TA) | Active | DRAM | - | 85ns | Parallel | 4.5 V ~ 5.5 V | 50/44-TSOP II | 0 | 0 | |||
|
|
|
VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
|
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
|
|
|
VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
|
|
|
VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
|
|
|
VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 16K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 16Kb (2K x 8, 1K x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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|
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 8K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 8Kb (1K x 8, 512 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 4K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 4Kb (512 x 8, 256 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | EEPROM | - | Surface Mount | 0°C ~ 70°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 | |||
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VIEW | Microchip Technology | IC EEPROM 2K SPI 3MHZ WAFER | Die | - | Tray | Non-Volatile | 2Kb (256 x 8, 128 x 16) | EEPROM | - | Surface Mount | -40°C ~ 85°C (TA) | Active | EEPROM | 3MHz | 2ms | SPI | 4.5 V ~ 5.5 V | Die | 0 | 0 |
