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19 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Memory Type | Memory Size | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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VIEW | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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GET PRICE |
15
In-stock
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Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 1 |
